"Pengenalan Komponen Hp: iPhone, Samsung, Huawei", membahas
Fokus: Fungsi, Gambar Bentuk & Posisi + Contoh Link Video Cara Bongkar Pasang dengan mengambil contoh 3 tipe dari 3 vendor smartphone iPhone (Amerika Serikat), Samsung (Korea Selatan), Huawei (Tiongkok) yaitu tipe:
Apple iPhone 11 Pro Max, Samsung Galaxy S10 Plus, Huawei Mate 30 Pro
- Contoh-contoh komponen handphone / spare parts Hp beserta fungsinya, antara lain: PWB (Printed Wired Board) atau mainboard, Chipset atau SoC (System on Chip), RAM, Internal Storage (ROM), Sensor
- Apa pengganti Headphone jack atau Port untuk Jack Audio 3.5mm?
- Apple iPhone 11 Pro Max: gambar Bentuk & Posisi Komponen earspeaker, Proximity sensor dan Mic Flex, OLED Display, Sim Card Tray, Speaker, Taptic Engine, battery, Rear Camera, Front Camera set, Tampak Dalam Mainboard, Storage: 64 GB, Sim Card Connector, SoC: Apple A13 Bionic, WiFi / Bluetooth SoC, Lightning connector, Microphone, LED Flash Light Flexibel Cable, GPS Flexibel Cable, Volume, Mute, Wireless Charging Flexibel
- Samsung Galaxy S10 Plus: gambar Bentuk & Posisi Komponen Charging coil, Sim card tray, Kamera depan, battery, motherboard, Storage: 1 TB, SoC: Qualcomm Snapdragon 855 dan RAM: 12 GB, USB Type C, 3 Camera belakang dan LED Flash, vibrator, headphone jack, Amoled Display, frame, Ultrasonic Fingerprint Sensor
- Huawei Mate 30 Pro: gambar Bentuk & Posisi Komponen NFC Antena, Sim card tray, OLED Display, Wireless Charging Module, RF Interface, 4 kamera belakang, ToF Lensa dan kamera depan, Motherboard, SoC: HiSilicon Kirin 990 dan RAM, ROM, WiFi / BT / Wireless Combo IC, PMIC, USB type C, Mic, sim card connector, Loudspeaker, Fingerprint, Battery.
Selengkapnya, silahkan ke: ==> https://www.rahasiahp.com/